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document number: mpx2202 rev 8, 10/2012 freescale semiconductor data sheet: technical data ? 2005-2008, 2012 freescale semico nductor, inc. all rights reserved. pressure 200 kpa on-chip temperature compensated silicon pressure sensors the mpx2202 devices series are silicon piezoresistive pressure sensor providing a highly accurate and linear voltage output directly proportional to the applied pressure. the sensor is a si ngle monolithic silicon diaphragm with the strain gauge and a thin-film resistor network integrated on chip. the chip is laser trimmed for precise span and offset calibration and temperature compensation. they are designed for use in applications such as pump/ motor controllers, robotics, level indi cators, medical diagnostics, pressure switching, baromete rs, altimeters, etc. features ? temperature compensated over 0 ? c to +85 ?c ? easy-to-use chip carrier package options ? available in absolute, differential and gauge configurations ? ratiometric to supply voltage ? available in easy-to-use tape and reel ordering information device name case no. # of ports pressure type device marking none single dual gauge differential absolute unibody package (mpx2202 series) mpx2202a 344 ? ? mpx2202a mpx2202dp 344c ? ? mpx2202dp mpx2202ap 344b ? ? mpx2202ap mpx2202gp 344b ? ? mpx2202gp mpx2202asx 344f ? ? mpx2202a small outline package (mpxv2202 series) mpxv2202gp 1369 ? ? mpxv2202gp mpxv2202dp 1351 ? ? mpxv2202dp mpxv2202gc6ti 482a ? ? mpxv2202g mpak package (mpxm2202 series) mpxm2202d 1320 ? ? mpxm2202d MPXM2202DT1 1320 ? ? mpxm2202d mpxm2202a 1320 ? ? mpxm2202a mpxm2202gs 1320a ? ? mpxm2202gs mpxm2202gst1 1320a ? ? mpxm2202gs mpxm2202as 1320a ? ? mpxm2202as mpx2202 series 0 to 200 kpa (0 to 29 psi) 40 mv full scale (typical) application examples ? pump/motor controllers ? robotics ? level indicators ? medical diagnostics ? pressure switching ? barometers ? altimeters
mpx2202 sensors 2 freescale semiconductor, inc. pressure mpx2202ap/gp case 344b-01 mpx2202dp case 344c-01 unibody packages mpx2202a case 344-15 small outline packages mpxv2202gp case 1369-01 mpx2202asx case 344f-01 mpxm2202a case 1320-02 mpxm2202gs/as case 1320a-02 mpak mpxv2202dp case 1351-01 mpxv2202gc6t1 case 482a-01
mpx2202 sensors freescale semiconductor, inc. 3 pressure operating characteristics table 1. operating characteristics (v s = 10 vdc, t a = 25 ? c unless otherwise noted, p1 > p2) characteristics symbol min typ max unit pressure range (1) absolute pressure range mpx2202a differential pressure range mpx2202d 1. 1.0 kpa (kilopascal) equals 0.145 psi. p op p op 20 0 ? ? 200 200 kpa kpa supply voltage (2) 2. device is ratiometric within this specified excitation range. operating the device above th e specified excitation range may i nduce additional error due to device self-heating. v s ?1016vdc supply current i o ?6.0?madc full scale span (3) 3. full scale span (v fss ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. v fss 38.5 40 41.5 mv offset (4) mpx2202d, mpxm2202d/g series mpx2202a, mpxm2202a series 4. offset (v off ) is defined as the output voltage at the minimum rated pressure. v off -1.0 -2.0 ? ? 1.0 2.0 mv sensitivity ? v/ ? p? 0.2 ?mv/kpa linearity (5) mpxm2202d/g, mpx2202d series mpxm2202a, mpx2202a series 5. accuracy (error budget) c onsists of the following: linearity:output deviation from a straight line relationship wi th pressure, using end point met hod, over the specified pressure range. temperature hysteresis:output deviation at any temperature within the operating temperature range, after the temperature is cyc led to and from the minimum or maximum operating temperature points, with zero differential pressure applied. pressure hysteresis:output deviati on at any pressure within the specified range, when this pressure is cycled to and from the m inimum or maximum rated pressure, at 25 ? c. tcspan:output deviation at full rated pressure over the temperature range of 0 to 85 ? c, relative to 25 ? c. tcoffset:output deviation with mini mum rated pressure applied, over the temperature range of 0 to 85 ? c, relative to 25 ? c. ?-0.6 -1.0 ? ? 0.4 1.0 %v fss pressure hysteresis (5) (0 to 200 kpa) ?? ? 0.1 ? %v fss temperature hysteresis (5) (-40 ? c to +125 ? c) ?? ? 0.5 ? %v fss temperature effect on full scale span (5) tcv fss -2.0 ? 2.0 %v fss temperature effect on offset (5) tcv off -1.0 ? 1.0 mv input impedance z in 1000 ? 2500 ? output impedance z out 1400 ? 3000 ? response time (6) (10% to 90%) 6. response time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when s ubjected to a specified step change in pressure. t r ?1.0?ms warm-up ? ? 20 ? ms offset stability (7) 7. offset stability is the product's output deviation when subjec ted to 1000 hours of pulsed pressure, temperature cycling with bias test. ?? ? 0.5 ? %v fss
mpx2202 sensors 4 freescale semiconductor, inc. pressure maximum ratings voltage output versus applied differential the differential voltage output of the sensor is directly proportional to the differential pressure applied. the absolute sensor has a built-in reference vacuum. the output voltage will decrease as vacuum, relative to ambient, is drawn on the pressure (p1) side. the output voltage of the diff erential or gauge sensor increases with increasing pressure applied to the pressure (p1) side relative to the vacuum (p2) side. similarly, output voltage increases as increasing vacuum is applied to the vacuum (p2) side relative to the pressure (p1) side. figure 1 illustrates a block diagram of the internal circuitry on the stand-alone pressure sensor chip. figure 1. temperature compensated and calibrated pressure sensor schematic table 2. maximum ratings (1) 1. exposure beyond the specified limits may cause permanent damag e or degradation to the device. rating max value unit maximum pressure (p1 > p2) 400 kpa storage temperature -40 to 125 ? c operating temperature -40 to 125 ? c +v out ?v out 4 2 v s 3 sensing element gnd 1 thin film temperature compensation and calibration circuitry
mpx2202 sensors freescale semiconductor, inc. 5 pressure on-chip temperature comp ensation and calibration figure 2. output vs. pressure differential figure 2 shows the output characteristics of the mpx2202 series at 25 ? c. the output is directly proportional to the differential pressure and is essentially a straight line. the effects of temperature on full scale span and offset are very small and are shown unde r operating characteristics. figure 3. cross sectional diagram (not to scale) figure 3 illustrates the differential/gauge die in the basic chip carrier (case 344). a silicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. the mpx2202 series pressure sensor operating characteristics and internal reliability and qualification tests are based on use of dry air as the pressure media. media other than dry air may have adverse effects on sensor performance and long term reliability. contact the factory for information regarding media compatibility in your application. linearity linearity refers to how well a transducer's output follows the equation: v out = v off + sensitivity x p over the operating pressure range. there are two basic methods for calculating nonlinearity: (1) end point straight line fit (see figure 4 ) or (2) a least squares best line fit. while a least squares fit gives the ?best case? linearity error (lower numerical value), the calculations required are burdensome. conversely, an end point fit will give the ?worst case? error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. freescale?s specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. figure 4. linearity sp ecification comparison output (mv dc ) vs = 10 v dc t a = 25 ? c p1 > p2 40 35 30 25 20 15 10 5 0 -5 typ max min span range (typ) offset (typ) 0 50 100 150 200 kpa psi 7.25 14.5 21.75 29 175 125 75 25 pressure lead frame wire bond differential/gauge die silicone gel die coat differential/gauge p2 die bond epoxy case stainless steel metal cover p1 silicone gel die coat absolute die p1 metal cover epoxy case absolute element p2 lead frame wire bond die bond stainless steel element least square deviation relative voltage output pressure (% full scale) 0 50 100 end point straight line fit exaggerated performance curve least squares fit straight line deviation offset
mpx2202 sensors 6 freescale semiconductor, inc. pressure pressure (p1)/vacuum (p2) side identification table freescale designates the two si des of the pressure sensor as the pressure (p1) side and the vacuum (p2) side. the pressure (p1) side is the side containing silicone gel which isolates the die from the environment. the freescale mpx pressure sensor is design ed to operate with positive differential pressure applied, p1 > p2. the pressure (p1) side may be identified by using the following table. table 3. pressure (p1) side delineation part number case type pressure (p1) side identifier mpx2202a 344 stainless steel cap mpx2202dp 344c side with part marking mpx2202gp/ap 344b side with port attached mpx2202asx 344f side with port attached mpx2202gp 1369 side with port attached mpx2202dp 1351 side with part marking mpxv2202gp 1369 side with port attached mpxv2202dp 1351 side with part marking mpxv2202gc6ti 482a side with port attached mpxm2202a/ati/dt/dti 1320 side with part marking mpxm2202gs/gsti/as/asti 1320a side with port attached
mpx2202 sensors freescale semiconductor, inc. 7 pressure package dimensions case 482a?01 issue a date 05/13/98 dim min max min max millimeters inches a 10.54 0.425 0.415 10.79 b 10.54 0.425 0.415 10.79 c 12.70 0.520 0.500 13.21 d 0.96 0.042 0.038 1.07 g 0.100 bsc 2.54 bsc h 0.002 0.010 0.05 0.25 j 0.009 0.011 0.23 0.28 k 0.061 0.071 1.55 1.80 m 0 7 0 7 n 0.444 0.448 11.28 11.38 s 0.709 0.725 18.01 18.41 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006). 5. all vertical surfaces 5 typical draft. s d g 8 pl 4 5 8 1 s b m 0.25 (0.010) a s t ?a? ?b? c m j k pin 1 identifier h seating plane ?t? n v w v 0.245 0.255 6.22 6.48 w 0.115 0.125 2.92 3.17
mpx2202 sensors 8 freescale semiconductor, inc. pressure notes: 1. 2. 3. dimensioning and tolerancing per asme y14.5m, 1994. controlling dimension: inch. dimension -a- is inclusive of the mold stop ring. mold stop ring not to exceed 16.00 (0.630). m a m 0.136 (0.005) t 1234 pin 1 r n l g f d 4 pl seating plane -t- c m j b -a- dambar trim zone: f this is included within dim. "f" 8 pl 1 23 4 y z style 1: pin 1. ground 2. + output 3. + supply 4. - output style 2: pin 1. v cc 2. - supply 3. + supply 4. ground style 3: pin 1. gnd 2. -vout 3. vs 4. +vout dim min max min max millimeters inches a 0.595 0.630 15.11 16.00 b 0.514 0.534 13.06 13.56 c 0.200 0.220 5.08 5.59 d 0.016 0.020 0.41 0.51 f 0.048 0.064 1.22 1.63 g 0.100 bsc 2.54 bsc j 0.014 0.016 0.36 0.40 l 0.695 0.725 17.65 18.42 m 30? nom 30? nom n 0.475 0.495 12.07 12.57 r 0.430 0.450 10.92 11.43 y 0.048 0.052 1.22 1.32 z 0.106 0.118 2.68 3.00 notes: 1. 2. dimensioning and tolerancing per ansi y14.5m, 1982. controlling dimension: inch. d 4 pl f u h l port #1 positive pressure (p1) pin 1 -a- -q- s k g -p- s q m 0.25 (0.010) t s s m 0.13 (0.005) q s t 12 34 seating plane b n r c j -t- style 1: pin 1. ground 2. + output 3. + supply 4. - output dim min max min max millimeters inches a 1.145 1.175 29.08 29.85 b 0.685 0.715 17.40 18.16 c 0.305 0.325 7.75 8.26 d 0.016 0.020 0.41 0.51 f 0.048 0.064 1.22 1.63 g 0.100 bsc 2.54 bsc h 0.182 0.194 4.62 4.93 j 0.014 0.016 0.36 0.41 k 0.695 0.725 17.65 18.42 l 0.290 0.300 7.37 7.62 n 0.420 0.440 10.67 11.18 p 0.153 0.159 3.89 4.04 q 0.153 0.159 3.89 4.04 r 0.230 0.250 5.84 6.35 s u 0.910 bsc 23.11 bsc 0.220 0.240 5.59 6.10 case 344-15 issue aa unibody package case 344b-01 issue b unibody package package dimensions
package dimensions mpx2202 sensors freescale semiconductor, inc. 9 notes: 1. 2. dimensioning and tolerancing per ansi y14.5m, 1982. controlling dimension: inch. port #2 port #1 port #2 vacuum (p2) (p1) seating plane seating plane k s w h l u f g d 4 pl port #1 positive pressure -q- 12 4 3 pin 1 -p- -t- -t- s q m 0.25 (0.010) t s s m 0.13 (0.005) q s t b n j c v r -a- style 1: pin 1. ground 2. + output 3. + supply 4. - output dim min max min max millimeters inches a 1.145 1.175 29.08 29.85 b 0.685 0.715 17.40 18.16 c 0.405 0.435 10.29 11.05 d 0.016 0.020 0.41 0.51 f 0.048 0.064 1.22 1.63 g 0.100 bsc 2.54 bsc h 0.182 0.194 4.62 4.93 j 0.014 0.016 0.36 0.41 k 0.695 0.725 17.65 18.42 l 0.290 0.300 7.37 7.62 n 0.420 0.440 10.67 11.18 p 0.153 0.159 3.89 4.04 q 0.153 0.159 3.89 4.04 r 0.063 0.083 1.60 2.11 s u 0.910 bsc 23.11 bsc v 0.248 0.278 6.30 7.06 w 0.310 0.330 7.87 8.38 0.220 0.240 5.59 6.10 case 344c-01 issue b unibody package notes: 1. 2. dimensioning and tolerancing per asme y14.5m, 1994. controlling dimension: inch. d 4 pl f u l h port #2 vacuum (p2) positive pressure (p1) pin 1 -a- -q- s k g -p- s q m 0.25 (0.010) t s s m 0.13 (0.005) q s t 12 34 seating plane b n r c j -t- style 1: pin 1. ground 2. + output 3. + supply 4. - output dim min max min max millimeters inches a 1.145 1.175 29.08 29.85 b 0.685 0.715 17.40 18.16 c 0.305 0.325 7.75 8.26 d 0.016 0.020 0.41 0.51 f 0.048 0.064 1.22 1.63 g 0.100 bsc 2.54 bsc h 0.182 0.194 4.62 4.93 j 0.014 0.016 0.36 0.41 k 0.695 0.725 17.65 18.42 l 0.290 0.300 7.37 7.62 n 0.420 0.440 10.67 11.18 p 0.153 0.159 3.89 4.04 q 0.153 0.158 3.89 4.04 r 0.230 0.250 5.84 6.35 s u 0.910 bsc 23.11 bsc 0.220 0.240 5.59 6.10 case 344d-01 issue b unibody package pressure
mpx2202 sensors 10 freescale semiconductor, inc. pressure page 1 of 2 package dimensions case 1351-01 issue a small outline package
mpx2202 sensors freescale semiconductor, inc. 11 pressure case 1351-01 issue a small outline package page 2 of 2
mpx2202 sensors 12 freescale semiconductor, inc. pressure case 1369-01 issue b small outline package
mpx2202 sensors freescale semiconductor, inc. 13 pressure case 1369-01 issue b small outline package package dimensions
mpx2202 sensors 14 freescale semiconductor, inc. pressure package dimensions case 1320-02 issue b mpak
mpx2202 sensors freescale semiconductor, inc. 15 pressure package dimensions case 1320-02 issue b mpak
mpx2202 sensors 16 freescale semiconductor, inc. pressure package dimensions pin 4 pin 1 case 1320a-02 issue a mpak
mpx2202 sensors freescale semiconductor, inc. 17 pressure package dimensions case 1320a-02 issue a mpak
mpx2202 sensors freescale semiconductor, inc. 18 pressure revision history revision number revision date description of changes 7 01/2012 ? in table 1. operating char acteristics, in the characteristic column under pressure range, added rows for absolute pressure range mpx2202a and differential pressure range mpx2202d devices 8 10/2012 ? deleted references to device nu mber mpxv2022gc6u throughout the document
mpx2202 rev. 8 10/2012 information in this document is provided solely to enable system and software implementers to use freescale products. there are no express or implied copyright licenses granted hereunder to design or fabr icate any integrated circuits based on the information in this document. freescale reserves the right to make changes without further notice to any products herein. freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does freescale assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. ?typical? parameters that may be provided in freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. all operating parameters, including ?typicals,? must be validated for each customer application by customer?s technical experts. freescale does not convey any license under its patent rights nor the rights of others. freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: freescale.com/salestermsandconditions. freescale and the freescale logo are trademarks of freescale semiconductor, inc., reg. u.s. pat. & tm. off. all other product or service names are the property of their respective owners. ? 2012 freescale semiconductor, inc. all rights reserved. how to reach us: home page: freescale.com web support: freescale.com/support

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